Hua Hong Semiconductor Limited (HKG:1347)
31.70
-1.30 (-3.94%)
May 13, 2025, 1:45 PM HKT
Hua Hong Semiconductor Dividend Information
Dividend Yield
0.50%
Annual Dividend
0.17 HKD
Ex-Dividend Date
n/a
Payout Frequency
n/a
Payout Ratio
120.66%
Dividend Growth(1Y)
n/a
Dividend History
Ex-Dividend Date | Cash Amount | Pay Date |
---|---|---|
Jun 3, 2024 | 0.165 HKD | Jun 26, 2024 |
* Dividend amounts are adjusted for stock splits when applicable.