Hor Kew Corporation Limited (SGX:BBP)
Singapore
· Delayed Price · Currency is SGD 1.190
-0.010 (-0.83%)
Last updated: Aug 15, 2025
Hor Kew Corporation Dividend Information
Hor Kew Corporation has an annual dividend of 0.03 SGD per share, with a yield of 2.52%. The last ex-dividend date was May 8, 2025.
Dividend Yield
2.52%
Annual Dividend
0.03 SGD
Ex-Dividend Date
May 8, 2025
Payout Frequency
n/a
Payout Ratio
10.47%
Dividend Growth(1Y)
n/a
Dividend History
| Ex-Dividend Date | Cash Amount | Pay Date |
|---|---|---|
| May 8, 2025 | 0.030 SGD | May 30, 2025 |
* Dividend amounts are adjusted for stock splits when applicable.