ChipMOS TECHNOLOGIES INC. (IMOS)
NASDAQ: IMOS · Real-Time Price · USD
18.31
+0.67 (3.80%)
At close: May 12, 2025, 4:00 PM
18.31
0.00 (0.00%)
After-hours: May 12, 2025, 4:05 PM EDT

Company Description

ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People’s Republic of China, Singapore, and internationally.

The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others.

It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages.

The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices.

In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology.

Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment.

Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics.

The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.

ChipMOS TECHNOLOGIES INC.
ChipMOS TECHNOLOGIES INC. logo
Country Taiwan
Founded 1997
Industry Semiconductors
Sector Technology
Employees 5,688
CEO Shih-Jye Cheng

Contact Details

Address:
No.1, Yanfa 1st Road, Hsinchu Science Park
Hsinchu City
Taiwan
Phone 886 3 577 0055
Website chipmos.com

Stock Details

Ticker Symbol IMOS
Exchange NASDAQ
Fiscal Year January - December
Reporting Currency TWD
CIK Code 0001123134
CUSIP Number 16965P103
ISIN Number US16965P2020
SIC Code 3674

Key Executives

Name Position
Shih-Jye Cheng Chairman, Chief Executive Officer and President
Silvia Su Chief Corporate Governance Officer, Vice President of Finance and Accounting Management Center and Director
Jesse Huang Senior Vice President of Strategy and Investor Relations
D. Y. Tsai Executive Vice President and Head of Business Management Center
Vincent Hsu Executive Vice President
Guang Hui Chen Deputy General Manager
Dr. G. S. Shen Deputy Director of Strategy and Investor Relations

Latest SEC Filings

Date Type Title
May 9, 2025 6-K Report of foreign issuer
May 5, 2025 6-K Report of foreign issuer
Apr 29, 2025 6-K Report of foreign issuer
Apr 25, 2025 6-K Report of foreign issuer
Apr 15, 2025 6-K Report of foreign issuer
Apr 15, 2025 20-F Annual and transition report of foreign private issuers
Apr 15, 2025 6-K Report of foreign issuer
Apr 10, 2025 6-K Report of foreign issuer
Mar 14, 2025 6-K Report of foreign issuer
Mar 13, 2025 6-K Report of foreign issuer